Memory devices and their operation with different sets of logical erase blocks

ABSTRACT

Methods of operating memory devices include storing data of a first type in a first set of logical erase blocks and storing data of a second type in a second set of logical erase blocks. The logical erase blocks of the first set of logical erase blocks each have a first size the logical erase blocks of the second set of logical erase blocks each have a second size different than the first size.

RELATED APPLICATION

This application is a Continuation of U.S. application Ser. No.13/195,308, titled “MEMORY DEVICES AND THEIR OPERATION WITH DIFFERENTSETS OF LOGICAL ERASE BLOCKS” (allowed and scheduled to issue as U.S.Pat. No. 8,199,587 on Jun. 12, 2012), which is a Continuation of U.S.application Ser. No. 12/875,763, titled “METHODS OF OPERATING MEMORYDEVICES INCLUDING DIFFERENT SETS OF LOGICAL ERASE BLOCKS,” filed Sep. 3,2010, (now U.S. Pat. No. 7,990,775), which is a Continuation of U.S.application Ser. No. 11/699,954, titled “MEMORY DEVICE ARCHITECTURES ANDOPERATION,” filed Jan. 30, 2007, (now U.S. Pat. No. 7,791,952), each ofwhich is commonly assigned and incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to semiconductor memory devices,and in particular, the present invention relates to non-volatile memorydevice architectures having varying block sizes.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic devices. There aremany different types of memory including random-access memory (RAM),read only memory (ROM), dynamic random access memory (DRAM), synchronousdynamic random access memory (SDRAM), and flash memory.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications. Flashmemory devices typically use a one-transistor memory cell that allowsfor high memory densities, high reliability, and low power consumption.Changes in threshold voltage of the cells, through programming of chargestorage or trapping layers or other physical phenomena, determine thedata value of each cell. Common uses for flash memory and othernon-volatile memory include personal computers, personal digitalassistants (PDAs), digital cameras, digital media players, digitalrecorders, games, appliances, vehicles, wireless devices, cellulartelephones, and removable memory modules, and the uses for non-volatilememory continue to expand.

Flash memory typically utilizes one of two basic architectures known asNOR flash and NAND flash. The designation is derived from the logic usedto read the devices. In NOR flash architecture, a column of memory cellsare coupled in parallel with each memory cell coupled to a bit line. InNAND flash architecture, a column of memory cells are coupled in serieswith only the first memory cell of the column coupled to a bit line.

Flash memory and other non-volatile memories are often grouped intosections called “erase blocks.” Each of the cells within an erase blockcan be electrically programmed selectively by altering the thresholdvoltage of an individual cell from an initial state. However, cells ofthe erase block are erased, or reverted to their initial state,generally in a single operation across the entire block. Any data in theerase block that is desired to be retained by the memory device mustfirst be copied to another location or buffer before performing theerase operation.

In part because of their large block sizes, NAND devices are primarilyused for storing data, such as audio, video or image files. Such filesare frequently read, but generally infrequently modified. Increasingly,however, NAND devices are being designed into embedded systems. Suchsystems have need for code and temporary parameter storage as well asdata storage. However, code and parameter data requires relativelyfrequent modification, requiring frequent and extensive movement orbuffering of the data in a block that is to be retained. As memorydensities continue to increase, block sizes are also tending toincrease, thus exacerbating this problem.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art foralternative memory architectures and their operation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a functional block diagram of an electronic system having atleast one memory device in accordance with an embodiment of theinvention.

FIG. 2 is a schematic of a portion of an example NAND memory array ofthe prior art.

FIG. 3 is a schematic of a portion of a NAND memory array showingphysical block architecture as might be used with an embodiment of theinvention

FIG. 4 is a block diagram of a portion of a memory device showingphysical block selection in accordance with an embodiment of theinvention.

FIG. 5 is a block diagram showing one example of logic for selectingmultiple physical blocks for erase operations and individual physicalblocks for other operations in accordance with an embodiment of theinvention.

FIG. 6 is a functional block diagram of a memory module having at leastone memory device in accordance with an embodiment of the invention.

DETAILED DESCRIPTION

In the following detailed description of the present embodiments,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration specific embodiments inwhich the inventions may be practiced. These embodiments are describedin sufficient detail to enable those skilled in the art to practice theinvention, and it is to be understood that other embodiments may beutilized and that process, electrical or mechanical changes may be madewithout departing from the scope of the present invention. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present invention is defined only by the appendedclaims and equivalents thereof.

The memory devices of the various embodiments include memory arrayslogically organized as one or more first memory erase blocks of a firstsize and one or more second memory erase blocks of a second size largerthan the first size. The block sizes can be defined, or predetermined,by a user of the device, or during fabrication or testing. In thismanner, data expected to require frequent updating can be stored inlocations corresponding to the first memory erase blocks while dataexpected to require relatively infrequent updating can be stored inlocations corresponding to the second memory erase blocks. Storing dataexpected to require relatively more frequent updating in smaller memoryblocks facilitates a reduction in unnecessary erasing of memory cells.In addition, by providing for larger memory blocks for storing dataexpected to require relatively less frequent updating, efficiencies canbe obtained in erasing larger quantities of memory cells concurrently.

FIG. 1 is a simplified block diagram of a NAND flash memory device 100coupled to a processor 130 as part of an electronic system, according toan embodiment of the invention. Some examples of electronic systemsinclude personal computers, personal digital assistants (PDAs), digitalcameras, digital media players, digital recorders, games, appliances,vehicles, wireless devices, cellular telephones and the like. Theprocessor 130 may be a memory controller or other external processor.

Memory device 100 includes an array of memory cells 104 arranged in rowsand columns. A row decode circuitry 108 and a column decode circuitry110 are provided to decode address signals. Address signals are receivedand decoded to access memory array 104. Memory device 100 also includesinput/output (I/O) control circuitry 112 to manage input of commands,addresses and data to the memory device 100 as well as output of dataand status information from the memory device 100. An address register114 is coupled between I/O control circuitry 112 and row decodecircuitry 108 and column decode circuitry 110 to latch the addresssignals prior to decoding. A command register 124 is coupled between I/Ocontrol circuitry 112 and control logic 116 to latch incoming commands.Control logic 116 controls access to the memory array 104 in response tothe commands and generates status information for the external processor130. The control logic 116 is coupled to row decode circuitry 108 andcolumn decode circuitry 110 to control the row decode circuitry 108 andcolumn decode circuitry 110 in response to the addresses. Row decodecircuitry 108 is configured in accordance with embodiments of theinvention to facilitate selection of multiple physical blocks of memorycells for normal erase operations while permitting individual selectionof single physical blocks of memory cells for other access operations.Normal erase operations are defined as erase operations performed duringthe use of the memory device when it is receiving its intendedoperational inputs.

Control logic 116 is also coupled to a cache register 118. Cacheregister 118 latches data, either incoming or outgoing, as directed bycontrol logic 116 to temporarily store data while the memory array 104is busy writing or reading, respectively, other data. During a writeoperation, data is passed from the cache register 118 to data register120 for transfer to the memory array 104; then new data is latched inthe cache register 118 from the I/O control circuitry 112. During a readoperation, data is passed from the cache register 118 to the I/O controlcircuitry 112 for output to the external processor 130; then new data ispassed from the data register 120 to the cache register 118. A statusregister 122 is coupled between I/O control circuitry 112 and controllogic 116 to latch the status information for output to the processor130.

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals may include achip enable CE#, a command latch enable CLE, an address latch enableALE, and a write enable WE# in accordance with the present invention.Memory device 100 receives command signals (or commands), addresssignals (or addresses), and data signals (or data) from processor 130over a multiplexed input/output (I/O) bus 134 and outputs data toprocessor 130 over I/O bus 134.

Specifically, the commands are received over input/output (I/O) pins[0:7] of I/O bus 134 at I/O control circuitry 112 and are written intocommand register 124. The addresses are received over input/output (I/O)pins [0:7] of bus 134 at I/O control circuitry 112 and are written intoaddress register 114. The data are received over input/output (I/O) pins[0:7] for an 8-bit device or input/output (I/O) pins [0:15] for a 16-bitdevice at I/O control circuitry 112 and are written into cache register118. The data are subsequently written into data register 120 forprogramming memory array 104. For another embodiment, cache register 118may be omitted, and the data are written directly into data register120. Data are also output over input/output (I/O) pins [0:7] for an8-bit device or input/output (I/O) pins [0:15] for a 16-bit device. Itwill be appreciated by those skilled in the art that additionalcircuitry and control signals can be provided, and that the memorydevice of FIG. 1 has been simplified to help focus on the invention.Additionally, while the memory device of FIG. 1 has been described inaccordance with popular conventions for receipt and output of thevarious signals, it is noted that the various embodiments are notlimited by the specific signals and I/O configurations described unlessexpressly noted herein.

A control register 126 may be coupled to control logic 116 to store oneor more addresses. Addresses stored in control register 126 may be usedto define portions of the memory array 104 having different logicalerase block sizes. For example, the control register 126 could definestarting and ending addresses for physical blocks associated with firstlogical erase blocks of one physical block each and starting and endingaddresses for physical blocks associated with second logical eraseblocks of two physical blocks each. It will be apparent that defining astarting and ending address would not require storing two addresses. Forexample, for a device having two sets of logical erase blocks, thecontrol register could store just one address to define both sets oflogical erase blocks, i.e., the starting address of the first set couldbe the first address of the memory device by default, the stored addresscould be the ending address of the first set, the starting address ofthe second set could be the stored address plus 1 and the ending addressof the second set could be the last address of the memory device bydefault. Control register 126 could be loaded with its address value(s)in response to a command received on control link 132. Control register126 could be formed of latches that would reset upon power-down.Alternatively, control register 126 could further include non-volatileregisters of memory cells of the type used in the memory array 104 orhard-programmed devices, such as fuses, to permit the definitions to beretained upon power-down.

A software driver could be included in processor 130 ascomputer-readable instructions to cause the processor 130 to managestorage of data to the different portions of the memory array 104corresponding to the various logical erase block sizes. The processor130 could further be configured to direct data to different logicalerase blocks based on characteristics of the data. For example, theprocessor 130 could direct the data to logical erase blocks based uponthe file type being saved, the size of the file to be saved, the sourceof the data to be saved or some other criteria.

FIG. 2 is a schematic of a portion of an example NAND memory array 200as might be found in the memory array 104 of FIG. 1. As shown in FIG. 2,the memory array 200 includes word lines 202 ₁ to 202 _(N) andintersecting bit lines 204 ₁ to 204 _(M). For ease of addressing in thedigital environment, the number of word lines 202 and the number of bitlines 204 are generally each some power of two.

Memory array 200 includes NAND strings 206 ₁ to 206 _(M). Each NANDstring includes transistors 208 ₁ to 208 _(N), each located at anintersection of a word line 202 and a bit line 204. The transistors 208,depicted as floating-gate transistors in FIG. 2, represent non-volatilememory cells for storage of data. The floating-gate transistors 208 ofeach NAND string 206 are connected in series source to drain between oneor more source select gates 210, e.g., a field-effect transistor (FET),and one or more drain select gates 212, e.g., an FET. Each source selectgate 210 is located at an intersection of a local bit line 204 and asource select line 214, while each drain select gate 212 is located atan intersection of a local bit line 204 and a drain select line 215.

A source of each source select gate 210 is connected to a common sourceline 216. The drain of each source select gate 210 is connected to thesource of the first floating-gate transistor 208 of the correspondingNAND string 206. For example, the drain of source select gate 210 ₁ isconnected to the source of floating-gate transistor 208 ₁ of thecorresponding NAND string 206 ₁. A control gate 220 of each sourceselect gate 210 is connected to source select line 214. If multiplesource select gates 210 are utilized for a given NAND string 206, theywould be coupled in series between the common source line 216 and thefirst floating-gate transistor 208 of that NAND string 206.

The drain of each drain select gate 212 is connected to a local bit line204 for the corresponding NAND string at a drain contact 228. Forexample, the drain of drain select gate 212 ₁ is connected to the localbit line 204 ₁ for the corresponding NAND string 206 ₁ at drain contact228 ₁. The source of each drain select gate 212 is connected to thedrain of the last floating-gate transistor 208 of the corresponding NANDstring 206. For example, the source of drain select gate 212 ₁ isconnected to the drain of floating-gate transistor 208 _(N) of thecorresponding NAND string 206 ₁. If multiple drain select gates 212 areutilized for a given NAND string 206, they would be coupled in seriesbetween the corresponding bit line 204 and the last floating-gatetransistor 208 _(N) of that NAND string 206.

Typical construction of floating-gate transistors 208 includes a source230 and a drain 232, a floating gate 234, and a control gate 236, asshown in FIG. 2. Floating-gate transistors 208 have their control gates236 coupled to a word line 202. A column of the floating-gatetransistors 208 are those NAND strings 206 coupled to a given local bitline 204. A row of the floating-gate transistors 208 are thosetransistors commonly coupled to a given word line 202. Other forms oftransistors 208 may also be utilized with embodiments of the invention,such as NROM, magnetic or ferroelectric transistors and othertransistors capable of being programmed to assume one of two or moredata states. Although the NAND memory array 200 is typical of NANDarchitecture, other configurations of non-volatile memory are understoodin the art. However, the various embodiments described herein are notlimited by the architecture of the memory array.

FIG. 3 is a schematic of a portion of a NAND memory array 300 as aportion of memory array 104 of FIG. 1 showing physical blockarchitecture as might be used with an embodiment of the invention. Thememory cells 308 of the array 300 are substantially as described withreference to FIG. 2. As shown in FIG. 3, the memory array 300 isorganized into physical blocks of memory cells 340. For the variousembodiments, each erase block may contain one or more physical blocks340.

Four physical blocks of memory cells, i.e., 340 ₀, 340 ₁, 340 ₂ and 340₃, are depicted in FIG. 3. While fewer physical blocks could be defined,desirable configurations could contain substantially greater numbers ofphysical blocks. Each physical block 340 is depicted to include threebit lines 304 ₀, 304 ₁ and 304 ₂. While fewer bit lines could bedefined, desirable configurations could contain substantially greaternumbers of bit lines. Each physical block 340 includes one string ofmemory cells 308 coupled to each of its bit lines 304, and with each ofthe strings of memory cells coupled to a source line 316. Although notrequired, adjacent blocks 340 may share a source line 316. For example,physical blocks 340 ₀ and 340 ₁ may share source line 316 ₀₋₁, physicalblocks 340 ₂ and 340 ₃ may share source line 316 ₂₋₃, and so on. Eachsource select gate 310 or SGS is located at an intersection of a bitline 304 and a source select line 314, while each drain select gate 312or SGD is located at an intersection of a bit line 304 and a drainselect line 315. Although depicted to include only one source selectgate 310 and one drain select gate 312, each string of memory cells 308may include multiple select gates as described with reference to FIG. 2.

FIG. 4 is a block diagram of a portion of a memory device showingphysical block selection in accordance with an embodiment of theinvention. To create logical erase blocks containing more than onephysical block 340, the memory device would be adapted to facilitateselection of multiple physical blocks 340 during an erase operation as asingle erase block containing multiple strings per bit line, yetindividually select those same physical blocks 340 during read andprogram operations such that only one string per bit line is being reador programmed at a time. For example, where even and odd physical blocks340 share a source line, it may be desirable that only one physicalblock 340 be active for any one source line. In this circumstance, amultiple-string erase block might contain two or more even physicalblocks, e.g., physical block 340 ₀ and physical block 340 ₂. During anerase operation, both of the physical blocks 340 ₀ and 340 ₂ would beselected by row decode circuitry 108, i.e., word lines in both of thephysical blocks 340 ₀ and 340 ₂ would be activated. But, during read andprogram operations, only one of the physical blocks 340 ₀ or 340 ₂ wouldbe selected by row decode circuitry 108, i.e., word lines in only one ofthe physical blocks 340 ₀ or 340 ₂ would be driven with either a passvoltage or a read voltage. Alternatively, adjacent or multiplecontiguous physical blocks 340 could form a multiple-string erase block.Similar to the previous example, during an erase operation, all physicalblocks 340 of the multiple-string erase block would be selected, butduring read and program operations, only one of the constituent physicalblocks 340 would be activated. And while the foregoing examples focusedon even/odd, adjacent and contiguous physical blocks 340 making up amultiple-string erase block, such logical erase blocks could use anycombination of physical blocks 340 as will be apparent herein.

For the various embodiments, the logical erase blocks have at least twodifferent sizes, i.e., one or more first erase blocks contain X physicalblocks 340 and one or more second erase blocks contain Y physical blocks340, where X is an integer value equal to or greater than one, Y is aninteger value equal to or greater than two, and X does not equal Y. Asan example, a memory device may have first erase blocks containing onephysical block 340 per first erase block, such that an erase operationof a first erase block erases one string of memory cells per bit line,and second erase blocks containing four physical blocks 340 per seconderase block, such that an erase operation of a second erase block erasesfour strings of memory cells per bit line. It should be apparent thatthe charge pumps or other circuitry for generating internal voltageswould have to be sized to provide sufficient current for erasingmultiple strings of memory cells per bit line.

FIG. 5 is a block diagram showing one example of logic to facilitateselecting multiple physical blocks 340 for erase operations andindividual physical blocks 340 for read and program operations. Rowdecode circuitry 108 of FIGS. 1 and 3 generally includes match circuitrycorresponding to each physical block that analyzes an incoming addresssignal and activates its corresponding physical block if the addresssignal matches the address of the physical block. For example, if theaddress signal Addr matched the address of the physical block 340, theoutput of match circuit 508 would be logic high, if the address signalAddr matched the address of the physical block 340′, the output of matchcircuit 508′ would be logic high, and if the address signal Addr matchedthe address of the physical block 340″, the output of match circuit 508″would be logic high.

By adding appropriate logic, the output of a first or master matchcircuit can be used to select its corresponding physical block and oneor more physical blocks corresponding to second or slave match circuits.FIG. 5 shows just one example of how this can be done. In FIG. 5, theoutput of match circuit 508 is provided to a first input of AND gate510, and an output of the AND gate 510 is provided to a first input ofOR gate 515. The output of match circuit 508′ if provided to a secondinput of OR gate 515, and an output of the OR gate 515 provides forselection of the physical block 340′. A control signal CmbBlk isindicative of a desire to combine multiple physical blocks forselection. For example, if the control signal CmbBlk has a logic lowvalue, the output of the AND gate 510 is logic low and the OR gate 515has an output that is responsive to the output of the match circuit508′. However, if the control signal CmbBlk has a logic high value, theoutput of the AND gate 510 is responsive to the output of the mastermatch circuit 508, allowing the physical block 508′ to be selected ifthe address signal Addr matches the address of the physical block 508.Thus, the control logic of the memory device would set the controlsignal CmbBlk to a logic high value if it is desired to select multiplephysical blocks 340 for erasure, and set the control signal CmbBlk to alogic low value if it is desired to select individual physical blocks340 for reading or programming. To combine more than two physical blocksinto a logical erase block, the master match circuit 508 could becoupled to additional physical blocks in a manner similar to thecoupling of match circuit 508 to physical block 340′. As noted, this isjust one example of how multiple physical blocks 340 could beconcurrently selected for erasure as a logical erase block whilepermitting individual selection of physical blocks 340 for otheroperations.

Match circuit 508″ is neither a master match circuit nor a slave matchcircuit and is responsive to the address signal Addr in exclusivelyselecting its corresponding physical block 340″. In this manner,physical blocks 340 and 340′ could form one logical erase block havingtwo physical blocks while physical block 340″ could form a differentlogical erase block having only physical block 340″. While FIG. 5depicts a first erase block having one physical block and a second eraseblock having two physical blocks, the various embodiments could providefor additional or alternative logical erase block sizes.

Although the example of FIG. 5 depicts a hardware configuration forconcurrently selecting multiple physical blocks sharing the same bitlines, the access circuitry could programmatically activate multiplephysical blocks in response to a single logical block address. In thatmanner, any combination of physical blocks could be used to define alogical erase block.

In practice, a first portion of the memory array corresponding tosmaller logical erase blocks could be reserved for system data, such asoperation code and temporary parameter data, while a second portion ofthe memory array corresponding to larger logical erase blocks could bereserved for relatively static data storage, such as user data. Thereserved portions could be hard-coded into the memory device such asthrough the use of fusible elements, or they could be programmable suchas through the setting of volatile or non-volatile registers defininglogical address ranges for each portion. Programmable registers arecommonly used to define timing characteristics, voltage levels and otheroperating parameters for memory devices. Additional portions of thememory array corresponding to different logical block sizes could alsobe defined. As just one example, a first portion having one physicalblock per logical erase block may be reserved for temporary parametervalues, a second portion having two physical blocks per logical eraseblock may be reserved for operation code, a third portion having fourphysical blocks per logical erase block may be reserved for user dataand a fourth portion having eight physical blocks per logical eraseblock may be reserved for archival data. In erasing the differentlogical erase blocks, the memory device could be configured such thatall physical blocks of a logical erase block could be erased in responseto an address corresponding to any one of the physical blocks of thelogical erase block. Alternatively, the memory device could beconfigured such that all physical blocks of an erase block could beerased in response to an address corresponding to a first one of thephysical blocks of the logical erase block, but physical blocks could beindividually erased in response to addresses corresponding to any of theother physical blocks of the logical erase block.

FIG. 6 is an illustration of a memory module 600 in accordance with anembodiment of the invention. Memory module 600 is illustrated as amemory card, although the concepts discussed with reference to memorymodule 600 are applicable to other types of removable or portablememory, e.g., USB flash drives, and are intended to be within the scopeof “memory module” as used herein. In addition, although one exampleform factor is depicted in FIG. 6, these concepts are applicable toother form factors as well.

In some embodiments, memory module 600 will include a housing 605 (asdepicted) to enclose one or more memory devices 610, though such ahousing is not essential to all devices or device applications. At leastone memory device 610 is a non-volatile memory in accordance with anembodiment of the invention. Where present, the housing 605 includes oneor more contacts 615 for communication with a host device. Examples ofhost devices include personal computers, PDAs, digital cameras, digitalmedia players, digital recorders, games, appliances, vehicles, wirelessdevices, cellular telephones, memory card readers, interface hubs andthe like. For some embodiments, the contacts 615 are in the form of astandardized interface. For example, with a USB flash drive, thecontacts 615 might be in the form of a USB Type-A male connector. Ingeneral, contacts 615 provide an interface for passing control, addressand/or data signals between the memory module 600 and a host havingcompatible receptors for the contacts 615.

The memory module 600 may optionally include additional circuitry 620which may be one or more integrated circuits and/or discrete components.For some embodiments, the additional circuitry 620 may include a memorycontroller for controlling access across multiple memory devices 610and/or for providing a translation layer between an external host and amemory device 610. For example, there may not be a one-to-onecorrespondence between the number of contacts 615 and a number of I/Oconnections to the one or more memory devices 610. Thus, a memorycontroller could selectively couple an I/O connection (not shown in FIG.6) of a memory device 610 to receive the appropriate signal at theappropriate I/O connection at the appropriate time or to provide theappropriate signal at the appropriate contact 615 at the appropriatetime. Similarly, the communication protocol between a host and thememory module 600 may be different than what is required for access of amemory device 610. A memory controller could then translate the commandsequences received from a host into the appropriate command sequences toachieve the desired access to the memory device 610. Such translationmay further include changes in signal voltage levels in addition tocommand sequences.

The additional circuitry 620 may further include functionality unrelatedto control of a memory device 610 such as logic functions as might beperformed by an ASIC (application specific integrated circuit). Also,the additional circuitry 620 may include circuitry to restrict read orwrite access to the memory module 600, such as password protection,biometrics or the like. The additional circuitry 620 may includecircuitry to indicate a status of the memory module 600. For example,the additional circuitry 620 may include functionality to determinewhether power is being supplied to the memory module 600 and whether thememory module 600 is currently being accessed, and to display anindication of its status, such as a solid light while powered and aflashing light while being accessed. The additional circuitry 620 mayfurther include passive devices, such as decoupling capacitors to helpregulate power requirements within the memory module 600.

CONCLUSION

The memory devices of the various embodiments include non-volatilememory arrays logically organized to have erase blocks of at least twodifferent sizes. The various embodiments further provide for concurrenterasure of multiple physical blocks of memory cells, while providing forindividual selection of those physical blocks for read and programoperations. In this manner, data expected to require frequent updatingcan be stored in locations corresponding to first erase blocks having afirst size while data expected to require relatively infrequent updatingcan be stored in locations corresponding to second erase blocks largerthan the first erase blocks. Storing data expected to require relativelymore frequent updating in smaller memory blocks facilitates a reductionin unnecessary erasing of memory cells. In addition, by providing forlarger memory blocks for storing data expected to require relativelyless frequent updating, efficiencies can be obtained in erasing largerquantities of memory cells concurrently.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe invention will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the invention.

What is claimed is:
 1. An electronic system, comprising: a processor;and one or more memory devices coupled to the processor, wherein atleast one of the memory devices comprises: an array of memory cellsorganized into a plurality of erasable physical blocks; a controlregister storing an address of the array of memory cells, wherein theaddress is indicative of at least one of a starting address and anending address for physical blocks associated with a particular portionof the array of memory cells having a particular logical erase blocksize; and wherein the processor is configured to select storage of dataamong different physical blocks of the array of memory cells.
 2. Theelectronic system of claim 1, wherein the address is indicative of theending address for physical blocks associated with the particularportion of the array of memory cells having the particular logical eraseblock size, and wherein the address is indicative of a starting addressfor physical blocks associated with a different portion of the array ofmemory cells having a second logical erase block size different than theparticular logical erase block size.
 3. The electronic system of claim2, wherein the starting address for physical blocks associated with theparticular portion of the array of memory cells having the particularlogical erase block size is a first physical block address of the memorydevice.
 4. The electronic system of claim 2, wherein an ending addressfor physical blocks associated with the different portion of the arrayof memory cells having the second logical erase block size is a lastphysical block address of the memory device.
 5. The electronic system ofclaim 2, wherein the starting address for physical blocks associatedwith the different portion of the array of memory cells having thesecond logical erase block size is the next physical block address afterthe ending address for physical blocks associated with the particularportion of the array of memory cells having the particular logical eraseblock size.
 6. The electronic system of claim 2, wherein the particularlogical erase block size comprises one or more physical blocks, whereinthe second logical erase block size comprises two or more physicalblocks.
 7. The electronic system of claim 2, wherein the particularlogical erase block size comprises two or more physical blocks, whereinthe second logical erase block size comprises one or more physicalblocks.
 8. The electronic system of claim 1, wherein the address isindicative of the starting address for physical blocks associated withthe particular portion of the array of memory cells having theparticular logical erase block size, and wherein the control registerfurther stores a second address indicative of the ending address forphysical blocks associated with the particular portion of the array ofmemory cells having the particular logical erase block size.
 9. Theelectronic system of claim 8, wherein the control register furtherstores a third address indicative of a starting address for physicalblocks associated with a different portion of the array of memory cellshaving a second logical erase block size different than the particularlogical erase block size, and wherein the control register furtherstores a fourth address indicative of an ending address for physicalblocks associated with the different portion of the array of memorycells having the second logical erase block size.
 10. The electronicsystem of claim 1, wherein the control register comprises latches. 11.The memory device of claim 10, wherein the latches reset upon power-downof the memory device.
 12. The electronic system of claim 1, wherein thecontrol register comprises non-volatile registers.
 13. The electronicsystem of claim 12, wherein the non-volatile registers are selected fromthe group consisting of non-volatile memory cells and hard-programmeddevices.
 14. The electronic system of claim 1, wherein the processordirects data to different physical blocks of the array of memory cellsbased on characteristics of the data.
 15. An electronic system,comprising: a processor; and one or more memory devices coupled to theprocessor, wherein at least one of the memory devices comprises: anarray of memory cells organized into a plurality of erasable physicalblocks; a control register storing addresses of the array of memorycells, wherein the addresses are each indicative of a starting addressand an ending address for physical blocks associated with differentportions of the array of memory cells, wherein each portion of the arrayof memory cells has a particular logical erase block size; and whereinthe processor is configured to control storage of data to differentphysical blocks of the array of memory cells.
 16. The electronic systemof claim 15, wherein each portion of the array of memory cells has alogical erase block size that is different than a logical erase blocksize of any of the other portions of the array of memory cells.
 17. Theelectronic system of claim 15, wherein each address is indicative of theending address for physical blocks associated with one portion of thearray of memory cells and a starting address for physical blocksassociated with another portion of the array of memory cells.
 18. Theelectronic system of claim 15, wherein each particular address is aphysical block address of a last physical block for physical blocksassociated with a particular portion of the array of memory cells andwherein a starting address for physical blocks associated with asubsequent portion of the array of memory cells is a next physical blockaddress after the particular address.
 19. The electronic system of claim15, wherein the processor directs data to different physical blocks ofthe array of memory cells based on characteristics of the data.